Direct-to-chip cold plates
Cold plates for GPU and CPU platforms, manifold-ready and tuned to your CDU's pressure-drop budget.
AI Liquid Cooling Manufacturing Partner
ToneCooling Australia is the AI liquid cooling manufacturing partner for Australian engineering teams — the local customer engineering support and supply entity. Cold plate design, engineering, and manufacturing are delivered by our IATF 16949-aligned partner facility in Huizhou, Guangdong, China. Australian customer engineering support, project coordination, and AS/NZS compliance services are delivered by our Carlton, Victoria team. Direct-to-chip cold plate kits for NVIDIA GB200, GB300, H200, AMD EPYC SP5, and Intel Birch Stream platforms.
What We Provide
Cold plates for GPU and CPU platforms, manifold-ready and tuned to your CDU's pressure-drop budget.
Cold plate plus high-flex tubing, manifold, and quick-disconnect couplings as a pre-assembled, leak-tested unit.
OCP DC-MHS-aligned manifold pitch, CDU compatibility verification, and field-replaceable serviceability.
Carlton-based AU engineering support team in your time zone. Project coordination with the Huizhou design and engineering team, AS/NZS compliance documentation, and 24-hour response.
Position in the Stack
ToneCooling Australia's middle-layer scope: cold plates, hose & QD assemblies, and manifold-ready cooling modules. Not consumer PC liquid cooling, not facility-side CDUs.
Supported Platforms
Direct-to-chip cold plates engineered for the NVIDIA GB200 NVL72 platform and aligned to the Open Compute Project DC-MHS specification.
Core Manufacturing IP
| Manufacturing parameter | TLP (ToneCooling) | Vacuum brazing |
|---|---|---|
| Bonding cycle time | ~ 5 min | ~ 1 hour |
| Bond strength (relative) | 0.85 | 0.75 |
| Production yield | ~ 99 % | ~ 90 % |
| Microstructure | Continuous metallurgical grain | Filler-metal interface |
| Verification | Ultrasonic C-scan, every unit | Helium leak + pressure |
| Best fit | AI server, HPC, high-cycle | Lower TDP, cost-sensitive |
Bond integrity is verified on every production unit using ultrasonic C-scan inspection. Uniform blue regions on the C-scan image indicate void-free bonding — the absence of internal voids or unbonded interfaces. The TLP process is the manufacturing IP behind our reliability claims for thermal-cycling-critical applications such as direct-to-chip GB200, H200, and grid-forming PCS cooling.
Quality Assurance
Validation envelope aligned to the ASHRAE TC 9.9 Datacom liquid cooling guideline (W32 / W40); standards mapped to Standards Australia.
High-sensitivity helium leak detection ensures hermetic sealing. Detects micro-leakage defects after welding and assembly.
Sensitivity: ≤ 1×10⁻⁹ mbar·L/sNon-destructive inspection of bonded interfaces. Detects internal voids or unbonded regions across the cold plate area.
100 % production unit coverageMeasures coolant flow resistance and pressure drop. Verifies pressure-holding capability and structural integrity.
Copper and aluminium variantsThermal cycling tests simulate long-term operating conditions. Validates structural stability under temperature and humidity variations.
−40 °C to 150 °C · 20–98 % RHManufacturing
Multi-axis CNC machining centres for complex cooling channels. Machining accuracy up to ± 0.003 mm.
Proprietary TLP diffusion bonding, vacuum brazing, induction welding, and friction stir welding (FSW).
Helium leak detection, ultrasonic C-scan, pressure and flow resistance testing on every production unit.
Dedicated liquid cooling line, standardised QC processes, ~ 1,000,000 cold plates per year capacity.
200+ employees (40 % technical staff) · Patented manufacturing IP portfolio · Active engineering R&D programme
Australian Industry Extensions
Cold plates for grid-scale battery cabinets (TC-1P104S), Power Conversion Systems, and containerised storage. AS/NZS 5139 design-aware. AEMO 2024 ISP calls for 49 GW dispatchable storage by 2050.
BESS cooling →
Cold plates for IGBT, SiC, GaN modules in grid-forming PCS, photovoltaic central inverters, and rail traction (Inland Rail, Sydney Metro West, Cross River Rail).
Power electronics cooling →
Cold plates for mining trucks (Fortescue, BHP, Rio Tinto programmes), electric buses (Custom Denning, Volgren, BusTech), and marine electrification (Incat, Austal). Traction inverter and motor-controller cold plates supplied through the Power Electronics programme.
Power electronics cooling →
Custom cold plates for fibre and CO₂ laser sources (IPG, Coherent, Trumpf), medical CT/MRI imaging, factory automation drives, semiconductor process tools, and welding equipment.
Industrial cooling →Australian Compliance
| Compliance area | Documentation provided | Reference standard |
|---|---|---|
| Helium leak tightness | Leak-rate certificate per unit | Internal QMS, IATF 16949-aligned |
| Pressure / hydrostatic test | Pressure-test certificate per batch | QC/T 468-2010 · AS 1210 (where applicable) |
| Thermal cycling endurance | Cycle endurance test report | AS/NZS 60068-2-14 / IEC 60068-2-14 |
| Ingress protection (outdoor / coastal) | IP65 / IP66 evidence | AS/NZS 60529 |
| Salt spray (coastal sites) | Salt-spray test report | ISO 9227 |
| Material RoHS & PFAS-free | Third-party certificates | RoHS 2.0 (2011/65/EU + 2015/863) · EN 17681-1:2022 |
| First Article Inspection | FAI report | AS9102 |
| PPAP documentation | Levels 1–5 supported | IATF 16949-aligned |
| Country of origin (AU import) | ChAFTA Certificate of Origin | China-Australia FTA · Australian Consumer Law §29 |
Commercial Terms
| Stage | Owner | Output |
|---|---|---|
| 1. RFQ intake & engineering response | Carlton VIC team coordinated with Huizhou design and engineering team | Thermal sensitivity table, process recommendation, draft AUD quote |
| 2. NDA & DFM review session | Carlton + Huizhou joint Zoom session | CFD output, channel-topology proposal, hydraulic budget review |
| 3. Prototype & production delivery | Huizhou manufacturing → AU customer site | Lot-traceable QC certificates per shipment |
Frequently Asked
ToneCooling Australia is the AI liquid cooling supplier for Australian engineering teams — the local customer engineering support and supply entity. We supply direct-to-chip cold plates for NVIDIA GB200, GB300, H200, AMD EPYC SP5, and Intel Birch Stream platforms, plus secondary applications including BESS battery energy storage, grid-forming PCS power electronics, and heavy-EV thermal management.
Cold plate design, engineering, and manufacturing are performed at our IATF 16949-aligned partner facility in Huizhou, Guangdong, China. The Australian team in Carlton, Victoria delivers customer engineering support, project coordination, AS/NZS compliance services, and pre-sales engineering consultation.
Read more about ToneCooling Australia →TLP (Transient Liquid Phase) diffusion bonding is ToneCooling's proprietary cold plate manufacturing process. It forms a continuous metallurgical grain structure across the bonding interface, eliminating the brittle braze-filler interface layer found in conventional vacuum brazing.
Operational data: TLP cycles in 5 minutes per cold plate (vs 1 hour for vacuum brazing), bond strength 0.85 (vs 0.75), production yield 99 % (vs 90 %). Bond integrity is verified on every production unit using ultrasonic C-scan inspection.
Read the TLP diffusion bonding deep-dive →Every cold plate is validated at our manufacturing partner facility before shipment. The standard validation pack includes: helium leak detection to a sensitivity of 1×10⁻⁹ mbar·L/s; ultrasonic C-scan inspection of the bonded interface; pressure and flow performance testing; environmental reliability testing across −40 °C to 150 °C and 20–98 % RH.
Lot-traceable inspection certificates accompany every shipment to Australia.
Read the validation methodology →Beyond the primary AI server and data centre liquid cooling focus, ToneCooling Australia serves four AU-relevant secondary industries: battery energy storage systems (TC-1P104S BESS cold plate, AS/NZS 5139 design-aware); grid inverter and power electronics (74 % of AU's BESS pipeline now uses grid-forming inverters per AEMO Q1 2026); heavy-EV thermal management (mining trucks, electric buses, marine electrification); and industrial cold plates (fibre and CO₂ laser, medical imaging, robotics, semiconductor process tools, welding equipment).
See all solutions →Prototype minimum order available on request for tooled prototypes across all product families. AI server cold plate prototypes (GB200, H200, SP5, Birch Stream) ship as agreed at quotation door-to-door from Huizhou to Australian capital cities. BESS, power electronics, and heavy-EV cold plate prototypes ship as agreed at quotation. Production scale and lead times are agreed during quotation.
Read the RFQ input checklist →ToneCooling structures cold plate documentation around the standards your Australian installation auditor will reference: AS/NZS 5139:2019 design-aware (BESS battery system installation), AS/NZS 4777.2:2020 design-aware (grid-connected inverter), AS/NZS 60068-2-14 thermal cycling endurance reports, AS/NZS 60529 IP rating evidence.
Material substrates are dual-certified RoHS 2.0 plus PFAS-free per SGS Shanghai (steel) and CNAS-accredited Wonder Laboratories (aluminium). ChAFTA Certificate of Origin is supplied with every shipment.
See AS/NZS compliance scope →Most cold plate categories under HS 8419 / 8537 carry 0–5 % Australian import duty under the China-Australia Free Trade Agreement (ChAFTA) when accompanied by a Certificate of Origin issued by an authorised China-side body. ToneCooling provides ChAFTA-compliant Certificate of Origin documentation as part of every shipment package.
Confirm with your customs broker for your specific HS code declaration.
View AS/NZS standards reference →Send your TDP map, manifold sketch, or qualification scope to the Carlton engineering team. Carlton-coordinated engineering response within 24 working hours, with technical review by the Huizhou design team.
Request a Quote →Continue Exploring
Direct-to-chip cold plate kits for NVIDIA GB200, GB300, H200, AMD SP5, Intel Birch Stream.
View solution → SOLUTIONCold plates for AU grid-scale battery storage; TC-1P104S real test data; AEMO ISP-aligned.
View solution → CAPABILITYCore manufacturing IP — 5-min cycle, 99% yield, 0.85 bond strength. C-scan verified.
View capability → RESOURCE12-section engineering reference — channel topology, ΔP budget, manifold, CDU compatibility.
Read the guide →A complete RFQ — TDP map, target ΔP and flow rate, qualification scope, lead time — receives a Carlton-coordinated response within 24 working hours, with technical review by the Huizhou design and engineering team, including a thermal sensitivity table, process recommendation, and draft quote in AUD.
"Send us your TDP map, manifold sketch, and qualification scope. You'll get a ΔP-budgeted reply within 24 hours — coordinated by our Carlton support team and reviewed by the Huizhou design and engineering team, not a form." — ToneCooling Australia customer engineering support team, Carlton VIC