CPU Cold Plate · Phase 1 Primary Product
Server CPU Cold Plate Kits for Australian Buyers
Cold plate kits for two server CPU families: AMD EPYC SP5 (LGA6096 socket — supporting Genoa, Bergamo, Genoa-X, Turin generations, 400 W per socket reference) and Intel Birch Stream (Granite Rapids, Sierra Forest, 350–500 W reference). Both options available in vacuum-brazed copper (hyperscaler grade, helium-leak certified) or skive-and-bond (cost-sensitive volume) configurations. Channel topology and fin pitch tune to your CDU's pressure-drop budget. Cold plates designed, engineered & manufactured at our IATF 16949-aligned partner facility in Huizhou; AS/NZS support from Carlton VIC.
Server CPU cold plate specifications
Verified design-rated specifications for ToneCooling direct-to-chip CPU cold plates. Values are validated at the stated working point; final values are confirmed per drawing, TDP, flow rate and pressure-drop limit.
AMD EPYC SP5 CPU cold plate
| Heat dissipation (design-rated) | 550 W × 2 (dual socket) |
|---|---|
| Cold plate material | Copper C1100 |
| Joining process | TLP diffusion bonding |
| Working point | 42 °C, 1 L/min, 25% EGW |
| Flow resistance (ΔP) | < 3 kPa |
| Cold-plate surface temp | < 52 °C |
| Proof pressure | 0.6 MPa |
| Dimensions (L × W × H) | 118 × 92.4 × 25 mm |
Intel Xeon (Birch Stream) CPU cold plate
| Heat dissipation (design-rated) | 500 W |
|---|---|
| Cold plate material | Copper C1100 |
| Joining process | TLP diffusion bonding |
| Working point | 40 °C, 1 L/min, 25% EGW |
| Flow resistance (ΔP) | 5 kPa |
| Cold-plate surface temp | 60 °C |
| Proof pressure | 1 MPa |
| Dimensions (L × W × H) | 130 × 90 × 25 mm |
Designed, engineered and manufactured at the IATF 16949-aligned ToneCooling facility in Huizhou, Guangdong, China; Australian customer engineering support and AS/NZS compliance documentation from Carlton, Victoria.
Product Snapshot · 4 KPI
Engineering Reference & Standards
What standards and platform references apply to AMD EPYC SP5 and Intel Birch Stream cold plates?
Which Australian CPU server programmes does ToneCooling support?
Genoa · Bergamo · Genoa-X · Turin generations
AU sovereign cloud and AI cluster builds adopting AMD EPYC SP5. LGA6096 socket, 350–500 W reference TDP, copper or aluminium substrate. Vacuum-brazed, TLP-bonded, or skive-and-bond options.
Granite Rapids · Sierra Forest generations
AU hyperscale and Tier-1 colocation deployments adopting Intel Birch Stream platform. ASHRAE W32 / W40 thermal envelope, AS/NZS 60068-2-14 thermal cycling endurance, lot-traceable manufacturing.
Pawsey · NCI Gadi-class HPC nodes
Australian HPC supercomputing refresh cycles requiring high-density CPU cooling. Direct-to-chip cooling 80–120 kW per rack capable, TLP diffusion bonding for thermal-cycling-critical workloads.
Section 1 of 5
What AMD EPYC SP5 generations are supported?
| Generation | Codename | Reference TDP | Cold plate process |
|---|---|---|---|
| EPYC 9004 (Genoa) | Zen 4 / 96-core | 280–400 W | Vacuum braze · TLP optional |
| EPYC 9004 (Bergamo) | Zen 4c / 128-core | 300–400 W | Vacuum braze · TLP optional |
| EPYC 9004 (Genoa-X) | Zen 4 + 3D V-Cache | 320–400 W | Vacuum braze · TLP recommended |
| EPYC 9005 (Turin) | Zen 5 | 350–500 W | Vacuum braze · TLP recommended |
Section 2 of 5
What Intel Birch Stream platforms are supported?
Section 3 of 5
What CPU TDP envelopes can be cooled?
Section 4 of 5
Vacuum brazing vs skive-and-bond — which is right?
| Process | Material | Strength | Cost tier | Suits |
|---|---|---|---|---|
| TLP diffusion bonding | Copper C1100 | 0.85 / 99% yield | Premium | AI training, sovereign cloud, high-cycling |
| Vacuum brazing | Copper C1100 | 0.75 / 90% yield | Standard | Hyperscaler grade, established |
| Skive-and-bond | Aluminium / copper | Volume-optimised | Cost-optimised | Volume server programmes |
Section 5 of 5
What AU compliance documentation is provided?
FAQ
What AMD EPYC SP5 generations are supported?
Genoa, Bergamo, Genoa-X (EPYC 9004), Turin (EPYC 9005). Reference TDP 400 W per socket; 350–500 W envelope. Vacuum-brazed copper or TLP diffusion-bonded copper.
What Intel Birch Stream platforms are supported?
Granite Rapids and Sierra Forest. 350–500 W TDP. Same process options as SP5.
What CPU TDP envelopes can be cooled?
350–500 W per socket standard; up to ~ 600 W with custom topology. ΔP 15–25 kPa at 5–8 L/min on 50/50 EGW, ASHRAE W32.
Vacuum brazing vs skive-and-bond — which is right?
Vacuum braze / TLP for hyperscaler grade; skive-and-bond for cost-optimised volume programmes. DFM review covers process selection.
What AU compliance documentation is provided?
Helium leak cert, C-scan report, AUD commercial invoice, ChAFTA Certificate of Origin, RoHS 2.0 declarations. AS/NZS 60068-2-14, ISO 9227, PPAP 1–5 on request.
Continue Exploring
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View solution → CAPABILITYTLP Diffusion Bonding
Premium copper bonding for high-cycling AI training and traction drive workloads.
View capability → RESOURCERFQ Input Checklist
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Socket footprint, target TDP, ΔP envelope, programme volume — Carlton-coordinated 24-hour response with technical review by Huizhou.
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