Fibre & CO₂ laser sources
Laser source diode and resonator cooling — IPG Photonics, Coherent, Trumpf. Tight ΔT envelope for wavelength stability.
Industrial Cold Plates · AU Long-Tail Application
Custom liquid cold plates for Australian industrial applications: fibre and CO₂ laser sources (IPG Photonics, Coherent, Trumpf), medical imaging gradient coils (Siemens Healthineers, GE Healthcare, Philips), factory automation drives (ABB, Bosch Rexroth, Festo, FANUC), semiconductor process tools, and welding equipment. Down to 0.3 mm minimum channel width using copper micro-channel topology, surface temperature uniformity ΔT ≤ 0.5 °C, CFD-validated and 100 % helium leak tested. Cold plates designed, engineered & manufactured at our IATF 16949-aligned partner facility in Huizhou.
Solution Snapshot · 4 KPI
Engineering Reference & Standards
Australian laser cutting, marking, and welding OEMs require copper micro-channel cold plates with hydraulic diameter ≤ 1.5 mm. Skived or TLP-bonded copper substrate; helium leak ≤ 1×10⁻⁹ mbar·L/s.
Medical-grade cold plates for Australian hospital and research imaging suites. Stainless-steel or non-magnetic aluminium substrate options. AS/NZS 60068-2-14 thermal cycling endurance for clinical environments.
Custom cold plates for Australian semiconductor process tools (CVD/PVD chambers, etch tools, lithography) and factory automation drive electronics. CFD-validated thermal uniformity, ISO 9001:2015 + IATF 16949:2016 lot-traceable manufacturing, PPAP Levels 1–5 OEM qualification scope.
Section 1 of 4
Laser source diode and resonator cooling — IPG Photonics, Coherent, Trumpf. Tight ΔT envelope for wavelength stability.
CT and MRI gradient coil cooling — Siemens Healthineers, GE Healthcare, Philips. Premium copper TLP-bonded plates.
Industrial drives, robotics — ABB, Bosch Rexroth, Festo, FANUC. Custom OEM footprints accepted.
Process chamber and chuck cooling — AU semiconductor facilities (Silanna, Cochlear silicon).
Welding power supply and torch cooling — Cigweld, Aldax. Industrial duty-cycle envelope.
Bespoke programmes for AU OEMs — research equipment, test & measurement, electric motor controllers.
Section 2 of 4
| Channel topology | Width range | Suitable for | Joining process |
|---|---|---|---|
| Micro-channel (copper) | 0.3–1 mm | Laser source, medical imaging gradient coil, semiconductor process | TLP / vacuum braze |
| Skive-and-bond fin | 1–3 mm | Industrial drives, automation, welding power supply | Diffusion bond |
| Stamped serpentine | 3–8 mm | Factory automation, mid-power industrial | CAB stamped-brazed |
| Machined | 2–10+ mm | Custom prototyping, low-volume premium programmes | Machining + cover plate |
Section 3 of 4
Section 4 of 4
Fibre/CO₂ laser sources (IPG, Coherent, Trumpf), medical imaging gradient coils (Siemens, GE, Philips), factory automation drives (ABB, Bosch Rexroth, Festo, FANUC), semiconductor process tools, welding equipment.
0.3 mm minimum width copper micro-channel; 1–3 mm skive-and-bond fin; 3–8 mm stamped serpentine; 2–10+ mm machined. ΔT surface uniformity ≤ 0.5 °C.
Copper C1100 with TLP diffusion bonding (premium thermal cycling reliability + tight dimensional tolerance for gradient coil mating). RoHS 2.0 + PFAS-free supported.
MOQ, prototype and production lead times, and annual capacity are agreed at quotation per programme. PPAP Levels 1–5 supported.
Continue Exploring
OEM-custom programmes for laser, medical, automation, semiconductor cold plates.
View product → CAPABILITYPremium-grade copper bonding for medical imaging gradient coils and laser sources.
View capability → CAPABILITYHelium leak, ultrasonic C-scan, hydraulic ΔP, thermal cycling per AS/NZS 60068-2-14.
View capability → RESOURCE10-field checklist — the faster path to a Carlton-coordinated engineering response.
View checklist →Application, thermal envelope, channel topology preference, materials, programme volume — Carlton-coordinated 24-hour response with technical review by Huizhou.
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