Connect board-mounted heat sources to a defined chassis interface. Custom plates and frames are reviewed against your PCB height map, mechanical stack and enclosure thermal boundary.
Custom component supply. Configuration and acceptance criteria are agreed against your drawing.
Conduction cooling moves heat through solid interfaces to a chassis or another heat-rejection surface. It is useful when airflow at the PCB is restricted, but the chassis must still reject the heat. Define the temperature at the chassis contact, not only the external ambient.
| Interface | Information required | Typical design concern |
|---|---|---|
| Component → TIM | Package top height, allowable force, loss and temperature limit. | A pad that is too thick increases resistance; excessive compression can load the package or PCB. |
| TIM → plate / insert | Local contact height, flatness, material and surface condition. | Tolerance stack can leave some devices under-compressed while overloading others. |
| Plate → frame / chassis | Contact area, clamp method, mounting sequence and chassis temperature. | Small or poorly clamped contacts can dominate the overall thermal path. |
| Chassis → surroundings | How the enclosure rejects heat and the expected boundary temperature. | A conductive plate cannot compensate for an enclosure that cannot dissipate the total load. |
An aluminium structure can provide the main mechanical envelope while local copper spreading elements are evaluated near concentrated sources. Copper also adds mass; a copper insert is not automatically the best solution.
Specify the joining method and inspectable requirements. The joint between materials forms part of the heat path and must be included in the mechanical and thermal assessment.
Send nominal, minimum and maximum package heights relative to a common PCB datum. Include board bow, mounting stand-offs, TIM compression range and the plate’s contact-height tolerances. Assess both the hottest device and the device that receives the highest contact force.
For sealed industrial equipment used at Australian or New Zealand sites, define the enclosure temperature during the worst operating duty and its mounting condition. Outdoor exposure, nearby equipment and cabinet ventilation should be reflected in the boundary conditions rather than replaced with a generic room-temperature assumption.
Verify component clearances, contact heights, TIM compression and assembly loads against the released PCB and chassis revisions.
Apply the agreed device loss map and chassis boundary. Record component or case temperatures at specified locations after the agreed stabilisation period.
Assign vibration, shock, humidity and corrosion requirements to the relevant assembly. Test scope and acceptance limits are project-specific.
Request a dimensional drawing that identifies the board and chassis datums, contact heights, flatness, insert definition and finish masking. A thermal acceptance record must include the loss map, TIM and chassis contact temperature.
No verified model-specific performance datasheet is available for this custom reference. Request a drawing review and agree the technical document package for your configuration.
Request drawing and document scopeConstruction reference: ToneCooling European product page. Photographs show reference constructions, not a validated configuration for your project. Numerical performance will only be stated with its source and test conditions.
Define whether the quotation covers a plate, an assembled frame, inserts, fasteners or TIM. This page concerns solid conduction interfaces; any fluid-containing design needs a separate hydraulic and sealing specification.
Prepare my enquiry by emailOpens an editable email checklist; nothing is sent automatically. Attach your drawings before sending. NDA arrangements can be agreed before you share confidential files.
ToneCooling Australia Pty Ltd coordinates Australian and New Zealand enquiries; manufacturing is in Huizhou, Guangdong, China. Include the destination postcode and required delivery date. Currency, freight, lead time and included inspection documents are confirmed in the quotation.
No. Provide the applicable interface standard, revision and mechanical details. Envelope size alone does not establish interoperability, thermal performance or qualification.
Yes, subject to height, force and thermal-path review. Devices with different heights or temperature limits may require separate contact features or interface thicknesses.
A solid conduction plate has no coolant pressure boundary. Pressure and leak tests apply only if the supplied design contains a fluid circuit; do not substitute these for contact-height and thermal-path checks.
