GPU Cold Plate · Phase 1 Primary Product

NVIDIA GPU Cold Plate Kits for Australian Buyers

ToneCooling Australia supplies direct-to-chip cold plate kits for three NVIDIA GPU platforms most deployed in Australian sovereign cloud, HPC refresh, and edge AI: GB200 Grace Blackwell (2,700 W per Bianca module), GB300 Grace Blackwell Ultra (engineering preview, manifold-ready), and H200 (8-GPU baseboard, 8 × 700 W). Cold plate design, engineering, and manufacturing are performed at our IATF 16949-aligned partner facility in Huizhou, Guangdong, China. AS/NZS compliance documentation, customs coordination, and customer engineering support delivered by our Carlton, Victoria team.

3NVIDIA GPU platforms in catalogue
99 %TLP diffusion bonding production yield
2–4 weeksprototype lead time door-to-door
Customprogramme volume agreed at quotation
ToneCooling NVIDIA GB200 Bianca module cold plate kit with vacuum-brazed copper micro-channel structure and Stäubli quick-disconnect couplings
Process & standards glossary (AU engineering reader): TLP = Transient Liquid Phase diffusion bonding · FSW = Friction Stir Welding · CAB = Controlled Atmosphere Brazing · PPAP = Production Part Approval Process · IATF 16949:2016 (international automotive QMS) · ISO 9001:2015 (quality management) · AS/NZS 60068-2-14IEC 60068-2-14:2009 (thermal cycling endurance) · IEC 62619:2017 (industrial battery safety) · AS/NZS 5139:2019 (BESS installation) · AS/NZS 4777.2:2020 (grid-connected inverter).
Page reviewed by ToneCooling Australia Customer Engineering Support Team · Carlton, VIC · Last reviewed: 28 April 2026 · About the team →

Product Snapshot · 4 KPI

AI platforms
3
GB200 · GB300 · H200
Heat load / Bianca
2,700 W
per module · direct-to-chip
Helium leak rate
≤ 1×10⁻⁹
mbar·L/s · 100 % verified
Joining method
TLP / VB
diffusion-bonded or vacuum brazed

Engineering Reference & Standards

What standards and platform references apply to NVIDIA GB200 cold plates in Australia?

ToneCooling Australia supplies direct-to-chip GPU cold plates for the NVIDIA GB200, GB300, and H200 platforms. Bianca module geometry, manifold port-pitch, and ΔP budget align to NVIDIA developer documentation and the Open Compute Project DC-MHS specification. Quick-disconnect couplings reference Stäubli RBE03 dry-break standard. Thermal envelope per ASHRAE TC 9.9 W32 / W40 Datacom guideline.
≤ 1×10⁻⁹
mbar·L/s helium leak rate sensitivity
100 %
ultrasonic C-scan inspection per production unit
0–5 %
AU import duty under ChAFTA (HS 8419 / 8537)
PPAP 1–5
qualification levels supported on request

Section 1 of 6

What GB200 cold plate specifications apply?

The NVIDIA GB200 Grace Blackwell Bianca module mounts 2 × Blackwell GPU + 1 × Grace CPU on a single PCB, with a total thermal envelope of 2,700 W (1,200 W per Blackwell + 300 W for Grace). ToneCooling's GB200 cold plate is vacuum-brazed copper micro-channel construction (or TLP diffusion-bonded variant), helium-leak tested ≤ 1×10⁻⁹ mbar·L/s, and rated for 25–35 kPa ΔP at 10–12 L/min on 50/50 ethylene-glycol-water (EGW) coolant. NVL72 rack-scale configurations supported with manifold-ready architecture.
ToneCooling GB200 Bianca cold plate top view showing inlet/outlet ports and brazed copper construction
NVIDIA · Bianca module · Grace Blackwell

GB200 Cold Plate Kit

Direct-to-chip cold plate for the 2 × Blackwell GPU + 1 × Grace CPU configuration. Vacuum-brazed copper or TLP diffusion-bonded copper construction. Compatible with NVL72 rack-scale liquid cooling deployments.

2,700 W total NVL72 ready TLP available
Thermal envelope (per Bianca module)2,700 W (1,200 W + 1,200 W + 300 W)
Cold plate materialCopper C1100 (default) · Copper C1020 on request · Aluminium 6061 / 6063 cost-optimised variant
Joining processTLP diffusion bonding (preferred, 99 % yield) · vacuum brazing (legacy hyperscaler grade)
Channel topologyMicro-channel fin, 0.4–0.8 mm width, 1.5–3.0 mm depth
Reference flow rate10–12 L/min
Reference ΔP25–35 kPa at reference flow
Coolant compatibility50/50 EGW · 25 % propylene glycol (PG25) · ASHRAE W40 design
Inlet temperature window20–40 °C (ASHRAE W40-aligned)
Maximum working pressure0.35 MPa
Burst pressure≥ 4 MPa (lot-sample tested)
Quick-disconnect couplingStäubli RBE03 (default) · Colder Products Company NS6 (project-specific)
Manifold compatibilityOCP DC-MHS r1.0 / r1.1 manifold pitch · custom manifold orientation on RFQ
Helium leak rate≤ 1×10⁻⁹ mbar·L/s (every production unit, 100 %)
Bond verificationUltrasonic C-scan, every production unit, 100 %
Operating temperature range−40 °C to 150 °C, 20–98 % RH
NVL72 rack supportYes — manifold-ready architecture for rack-scale GB200 deployment

Section 2 of 6

When is GB300 available?

GB300 (NVIDIA Grace Blackwell Ultra) cold plate kits are in engineering preview ahead of NVIDIA's platform availability. Reference designs are aligned to the manifold-ready architecture used for GB200 NVL72 racks, with an updated thermal envelope reflecting Grace Blackwell Ultra's higher per-die TDP. Australian engineering teams designing programmes for the Q3 2026 platform refresh can engage now under NDA for engineering-preview cold plate samples and CFD-validated manifold integration.
ToneCooling GB300 Grace Blackwell Ultra cold plate engineering preview render with manifold-ready architecture
NVIDIA · Grace Blackwell Ultra (preview)

GB300 Cold Plate Kit (Engineering Preview)

Next-generation cold plate kit for the Grace Blackwell Ultra platform refresh. Engineering preview samples available under NDA for AU customers planning Q3 2026 deployments. Manifold-ready architecture inherited from GB200 NVL72.

Engineering preview NDA required Q3 2026
StatusEngineering preview · NDA required for sample release
Reference TDP envelopeHigher than GB200 (specific values disclosed under NDA)
Cold plate materialCopper C1100 (preview), TLP diffusion-bonded
Reference flow rate10–12 L/min (preview)
Reference ΔP28–38 kPa (preview, subject to platform finalisation)
Coolant compatibility50/50 EGW · ASHRAE W40 design
Manifold compatibilityGB200 NVL72-aligned manifold architecture
Helium leak rate target≤ 1×10⁻⁹ mbar·L/s (target, validated on engineering preview samples)
Australian availabilityEngineering preview Q1–Q2 2026 · production cold plates aligned to NVIDIA platform GA

Section 3 of 6

What H200 cold plate options exist?

The NVIDIA H200 8-GPU SXM baseboard mounts 8 × Hopper H200 GPUs (700 W each), 2 × NVSwitch fabric chips (134 W each), and 2 × host CPU sockets (typically Intel Xeon or AMD EPYC, 156 W reference). ToneCooling's H200 cold plate kit covers all 12 thermal sources on the baseboard with a unified plenum and manifold architecture. Reference operating point: 18.5 kPa ΔP at 8.0 L/min on 50/50 EGW coolant. Available in vacuum-brazed copper (default) or TLP diffusion-bonded copper (premium thermal cycling reliability).
ToneCooling NVIDIA H200 8-GPU SXM baseboard cold plate kit with unified plenum covering 8 GPUs, 2 NVSwitch, and 2 host CPU sockets
NVIDIA · 8-GPU SXM baseboard · Hopper

H200 Cold Plate Kit

Cold plate kit for the H200 8-GPU SXM baseboard, including the 8 × GPU sockets, 2 × NVSwitch fabric chips, and 2 × host CPU sockets in a unified manifold architecture.

7,148 W total 8 + 2 + 2 thermal sources 18.5 kPa @ 8.0 L/min
Thermal coverage8 × 700 W GPU + 2 × 134 W NVSwitch + 2 × 156 W host CPU = 7,148 W total baseboard envelope
Cold plate materialCopper C1100 (default) · TLP-bonded variant available
Joining processVacuum brazing (default) · TLP diffusion bonding (premium)
Reference flow rate8.0 L/min (per baseboard)
Reference ΔP18.5 kPa at 8.0 L/min, 32 °C inlet, 50/50 EGW
Coolant compatibility50/50 EGW · 25 % propylene glycol (PG25) · ASHRAE W32 design
Inlet temperature window20–32 °C (ASHRAE W32-aligned)
Manifold architectureUnified single-port baseboard plenum with internal flow distribution
Quick-disconnect couplingStäubli RBE03 · CPC NS6 · custom on RFQ
Helium leak rate≤ 1×10⁻⁹ mbar·L/s (every production unit, 100 %)
Bond verificationUltrasonic C-scan, every production unit, 100 %
Operating temperature range−40 °C to 150 °C, 20–98 % RH
HGX H200 baseboard compatibilityYes — kits supplied for OEM-finished servers and rack-builder customers

Section 4 of 6

Which CDU vendors are compatible?

ToneCooling Australia GPU cold plate kits are designed to integrate with the major rack-level CDU (Cooling Distribution Unit) vendors deployed in Australian data centres: Vertiv (Liebert XDU), CoolIT (CHx series), Stulz CMU, and Motivair. The cold plate's hydraulic envelope (ΔP, flow rate, coolant chemistry) is tuned during DFM iteration to align with your CDU's pump curve, thermal capacity, and operating window. ToneCooling supplies the cold plate, hose & QD assembly, and manifold-ready architecture; the CDU is supplied separately by your facility integrator.
CDU vendor Reference series Typical AU deployment Hydraulic alignment
Vertiv Liebert XDU Sydney, Melbourne sovereign cloud + colocation 50/50 EGW · ASHRAE W32 / W40 · ΔP budget 25–45 kPa rack-level
CoolIT CHx series Pawsey, NCI HPC refresh · sovereign-cloud private regions 50/50 EGW · ASHRAE W32 · ΔP budget 25–40 kPa rack-level
Stulz / 200 Mid-tier AU integrators · regional colocation 50/50 EGW · ASHRAE W32 · ΔP budget 20–35 kPa rack-level
Motivair Motivair HPC and AI training cluster builds 50/50 EGW · ASHRAE W40 · ΔP budget 25–40 kPa rack-level
Custom / OEM RFQ-specific Sovereign-compute and government integrator builds DFM iteration to your specific CDU pump curve and chemistry
Source: ToneCooling field-deployment context across Asia-Pacific and Australian customer programmes. Vendor names listed for descriptive interoperability purposes only — endorsement is not implied. CDU pump-curve and chemistry alignment is performed during DFM at our Huizhou engineering team's CFD workstation.

Because the cold plate sits inside the rack-level cooling loop, its hydraulic profile must align with the CDU's pump curve at the design operating point. The DFM review session (scheduled within 1 working week of NDA execution) maps your specific CDU's pump curve onto the cold plate's CFD-modelled ΔP–flow characteristic, identifies the design operating point, and validates thermal performance under the CDU's actual coolant chemistry and inlet-temperature window.

Section 5 of 6

What is the AU lead time?

AI server GPU cold plate prototype lead times agreed at quotation door-to-door from Huizhou to Australian capital cities (Sydney, Melbourne, Brisbane, Perth, Adelaide). The cycle is: Carlton-coordinated response on receipt of a complete RFQ; NDA executed promptly; DFM review session scheduled promptly; tooled prototype manufacturing and shipping within the agreed lead-time envelope. Production scale agreed during quotation with Production lead times agreed at quotation.
Stage Lead time Owner Deliverable
1. RFQ acknowledgement prompt Carlton VIC customer engineering support team Receipt confirmation; completeness check on TDP map / ΔP / flow rate / qualification scope
2. Engineering response prompt Carlton-coordinated; technical review by Huizhou design and engineering team Thermal sensitivity table, process recommendation (TLP / vacuum braze), draft quote in AUD
3. NDA execution within standard turnaround Carlton VIC team Mutual NDA signed; design-phase IP exchange enabled
4. DFM review session promptly Carlton + Huizhou joint Zoom session CFD output, channel-topology proposal, manifold-port alignment, hydraulic budget review
5. Prototype delivery Agreed at quotation Huizhou manufacturing → AU customer site Prototype cold plates with helium-leak certificate, ultrasonic C-scan report, ChAFTA Certificate of Origin
6. Production run Agreed at quotation Huizhou manufacturing Production lot with lot-traceable QC certificates
Lead times measured from receipt of complete RFQ. View the RFQ input checklist for what makes an RFQ "complete".

Australian procurement context

  • CurrencyAll quotes issued in AUD
  • GST10% applied at invoice; line pricing typically GST-exclusive
  • Customs duty0–5% under ChAFTA on HS 8419 / 8537 with Certificate of Origin
  • Commercial termsPayment schedule and incoterms agreed by separate written commercial agreement during the quotation process

Section 6 of 6

What customs documentation is provided?

Standard AU shipment documentation pack includes commercial invoice (in AUD with GST line), packing list, ChAFTA Certificate of Origin (issued by an authorised China-side body — required for 0–5% import duty under the China-Australia Free Trade Agreement, HS codes 8419 / 8537), bill of lading or air waybill, helium leak certificate per cold plate (for hyperscaler grade), ultrasonic C-scan report, and material certificates (RoHS 2.0, PFAS-free SGS Shanghai for steel substrates). Additional documentation (PPAP, FAI per AS9102, salt-spray per ISO 9227) on request.
📄

Commercial invoice (AUD)

Itemised invoice in Australian Dollars showing line pricing, GST line (10% if applicable), freight, and incoterms. Compliant with ATO record-keeping requirements.

Issued by Carlton
📦

Packing list

Per-pallet and per-carton breakdown: SKU, quantity, gross + net weight, volume (CBM), dimensions, country of origin (China), HS code declaration.

Per shipment
🇦🇺

ChAFTA Certificate of Origin

China-Australia Free Trade Agreement Certificate of Origin issued by an authorised China-side body, enabling 0–5% import duty on HS 8419 / 8537 cold plate categories.

Per shipment
🔬

Helium leak certificate

Per-cold-plate helium leak detection certificate, recording leak rate (target ≤ 1×10⁻⁹ mbar·L/s), test temperature, test duration, and detector calibration date.

Per cold plate, hyperscaler grade
📊

Ultrasonic C-scan report

Per-cold-plate ultrasonic C-scan image of the bonded interface, showing void-free bonding (uniform colour) — required for AI server grade and PPAP qualification programmes.

Per cold plate, premium grade

Material certificates

RoHS 2.0 declaration (CNAS-accredited Wonder Labs, ILAC-MRA recognised, NATA-equivalent). PFAS-free SGS Shanghai certificate per EN 17681-1:2022 (steel substrates). Mill test certificates for copper and aluminium.

Per lot

Frequently Asked

Procurement questions Australian buyers ask

What is the AU lead time for GPU cold plate prototypes?

AI server GPU cold plate prototype lead times agreed at quotation door-to-door from Huizhou to Australian capital cities (Sydney, Melbourne, Brisbane, Perth, Adelaide). The cycle is: Carlton-coordinated response on receipt of a complete RFQ; NDA executed promptly; DFM review session scheduled promptly; tooled prototype manufacturing and shipping within the agreed lead-time envelope. Production scale agreed during quotation with Production lead times agreed at quotation.

Are quotes inclusive or exclusive of GST?

All Australian quotes are issued in AUD and clearly state whether GST (10 %) is inclusive or exclusive of the line price. Standard practice for B2B engineering supply is GST-exclusive line pricing with GST applied at invoice. ToneCooling Australia Pty Ltd is GST-registered (ABN 96 653 174 040). For shipments under DDP terms, all import duty (typically 0–5 % under ChAFTA), GST, and customs clearance fees are itemised separately on the commercial invoice.

Is an NDA required before sharing TDP map and platform-specific designs?

Yes — for any platform-specific design work (custom socket geometry, OEM branding, project-specific TDP map, custom manifold orientation), a mutual NDA is signed before design IP is exchanged. Standard NDA templates are available; client-specific NDA templates are accepted. NDA execution is coordinated by the Carlton, Victoria customer engineering support team within within standard turnaround. Standard catalogue products (GB200, GB300, H200 reference cold plates) do not require an NDA — they are available against a standard purchase order.

Are reference customers available for due-diligence checks?

Reference customer disclosures are coordinated under mutual NDA. We can typically arrange a video call with one or two existing customers in similar deployment scopes (AI server / sovereign cloud / HPC) on request, subject to those customers' availability and confidentiality preferences. We can also share anonymised case studies (CFD output, validation reports, lot-traceable QC certificates) without NDA. The parent group has shipped 1,000,000+ cold plates annually across data centre, BESS, and power electronics sectors.

What is the minimum order quantity?

Tooled Prototype MOQ available on request across all GPU cold plate platforms (GB200, GB300, H200). Production scale agreed during quotation. There is no upper-bound MOQ — the parent group manufactures over 1,000,000 cold plates annually from a 30,000 m² facility, and individual programmes routinely scale to volume production capacity. Programme-specific PPAP qualification (Levels 1–5) is supported on request.

What commercial terms apply?

Commercial terms — currency, payment schedule, and incoterms — are agreed by separate written commercial agreement during the quotation process, in line with B2B engineering supply industry practice. All quotes are issued in AUD with line pricing typically GST-exclusive (10 % GST applied at invoice).

What customs documentation is provided for AU shipments?

Standard AU shipment documentation pack includes: commercial invoice (in AUD with GST line), packing list, ChAFTA Certificate of Origin (issued by an authorised China-side body — required for 0–5 % import duty under the China-Australia Free Trade Agreement, HS codes 8419 / 8537), bill of lading or air waybill, helium leak certificate per cold plate (for hyperscaler grade), ultrasonic C-scan report, and material certificates (RoHS 2.0, PFAS-free SGS Shanghai for steel substrates). Additional documentation (PPAP, FAI per AS9102, salt-spray per ISO 9227) on request.

Can a DFM review session be scheduled before the prototype order?

Yes. Following NDA execution, a DFM (Design for Manufacturability) review session is scheduled within 1 working week. The session is a Zoom meeting with joint Carlton + Huizhou attendance: the Carlton VIC customer engineering support team coordinates, and the Huizhou design and engineering team presents the CFD output, channel-topology proposal, manifold-port alignment, and hydraulic-budget review. The DFM session is included in the prototype quote at no separate fee. Outcomes of the session are captured in a signed DFM report before tooling commits.

Continue Exploring

Related ToneCooling Australia pages

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Direct-to-chip cold plate kits for AU sovereign cloud, Pawsey/NCI HPC refresh, edge AI.

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CAPABILITY

TLP Diffusion Bonding

Core manufacturing IP — 5-min cycle, 99% yield, 0.85 bond strength. C-scan verified.

View capability →
CAPABILITY

Validation & Qualification

100% helium leak ≤ 1×10−&sup9; mbar·L/s and ultrasonic C-scan inspection per cold plate.

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RESOURCE

AI Server Cooling Design Guide

12-section engineering reference — GB200/GB300/H200 channel topology and ΔP budget.

Read the guide →

Send your GPU cold plate brief

A complete RFQ — TDP map per platform, target ΔP and flow rate, CDU model, qualification scope, lead time — receives a Carlton-coordinated response within 24 working hours, with technical review by the Huizhou design and engineering team. You receive a thermal sensitivity table, process recommendation (TLP / vacuum braze), and draft quote in AUD.

Request a Quote   Email info@tonecooling.com.au

View parent global GPU cold plate catalogue (tonecooling.com)

Dedicated NVIDIA GPU cold plate pages