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Grid-forming context
74% of AU's BESS pipeline uses grid-forming inverters (AEMO Q1 2026). Higher harmonic cooling demands than grid-following.
Power Electronics Liquid Cooling · AU Industry Application
IGBT & SiC Power Electronics Liquid Cooling for Australia
IGBT and SiC module cold plates for Australian grid-forming inverters, traction drives, and PCS power electronics. AS/NZS 4777.2:2020 design context-aware. Supports standard module footprints from Infineon, Semikron, Mitsubishi, Fuji — plus custom OEM footprints. 74 % of AU's BESS pipeline now uses grid-forming inverters per AEMO Q1 2026, generating higher inverter cooling demands than legacy grid-following systems. Cold plates designed, engineered & manufactured at our IATF 16949-aligned partner facility in Huizhou; AS/NZS support from Carlton VIC.
3–25 kWpower dissipation per module envelope
125 / 150 °CTj limit IGBT / SiC
10–20 kPacold plate ΔP envelope
4–6 weeksprototype lead time door-to-door
Process & standards glossary (AU engineering reader):
TLP = Transient Liquid Phase diffusion bonding ·
FSW = Friction Stir Welding ·
CAB = Controlled Atmosphere Brazing ·
PPAP = Production Part Approval Process ·
IATF 16949:2016 (international automotive QMS) ·
ISO 9001:2015 (quality management) ·
AS/NZS 60068-2-14 ≡ IEC 60068-2-14:2009 (thermal cycling endurance) ·
IEC 62619:2017 (industrial battery safety) ·
AS/NZS 5139:2019 (BESS installation) ·
AS/NZS 4777.2:2020 (grid-connected inverter).
Page reviewed by
ToneCooling Australia Customer Engineering Support Team
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Carlton, VIC
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Last reviewed: 28 April 2026
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About the team →
Solution Snapshot · 4 KPI
Module brands supported
7+
Infineon · Semikron · Wolfspeed...
AS/NZS scope
4777.2:2020
grid-connected inverter context
Heat-load envelope
200–800 W
per module · custom geometry
Joining methods
4
TLP · vacuum braze · FSW · CAB
Engineering Reference & Standards
What standards and module references apply to Australian power electronics cooling?
ToneCooling Australia supplies liquid cold plates for Australian power electronics programmes. Custom IGBT and SiC module footprints from Infineon, Semikron, Mitsubishi, Fuji, Wolfspeed, ROHM, and onsemi. Engineered to Standards Australia AS/NZS 4777.2:2020 (grid-connected inverter) thermal context, and ASHRAE TC 9.9 envelope for adjacent data-centre power electronics.
Which Australian power electronics programmes does ToneCooling support?
Three Australian power electronics programme contexts shape cold plate procurement: grid-forming inverter (PCS for BESS), heavy-EV traction inverter, and major rail traction systems. Each has a different IGBT/SiC module mix, AS/NZS scope, and operating envelope.
Programme · Grid-forming PCS
AEMO ISP / CIS BESS inverter cooling
Grid-forming Power Conversion Systems for Australian grid-scale BESS — Infineon and Wolfspeed SiC modules, AS/NZS 4777.2:2020 design-aware, AS/NZS 5139:2019 BESS adjacency.
Programme · Heavy-EV traction
Mining truck · electric bus · marine
Australian heavy-EV traction inverter cold plates — Fortescue / BHP / Rio Tinto mining-truck pipelines, electric-bus operator context (Custom Denning, Volgren, BusTech), marine electrification (Incat, Austal context).
Programme · Rail traction
Inland Rail · Sydney Metro West · Cross River Rail
Major Australian rail infrastructure traction-inverter and motor-controller cold plates — Mitsubishi / Wolfspeed / ROHM module footprints, IATF 16949:2016-aligned manufacturing, PPAP Levels 1–5 documentation.
Section 1 of 3
What IGBT/SiC module footprints are supported?
ToneCooling supports standard IGBT and SiC module footprints from Infineon, Semikron, Mitsubishi, and Fuji — plus custom footprints for OEM grid-forming inverter and traction drive programmes. Power dissipation envelope per module: 3 kW (low-power inverters) to 25 kW+ (utility-scale grid-forming PCS). Junction temperature limits: Tj ≤ 125 °C for IGBT, ≤ 150 °C for SiC.
| Module family | Vendor | Application | Power envelope |
|---|---|---|---|
| EconoDUAL / PrimePACK / EasyPACK | Infineon Technologies | Grid-forming inverter, BESS PCS, EV traction drive | 3–25 kW per module |
| SEMITRANS / SEMiX | Semikron Danfoss | Industrial drives, BESS PCS, solar inverter | 3–20 kW per module |
| CM-series IGBT | Mitsubishi Electric | Industrial drives, traction drive, marine electrification | 5–25 kW per module |
| Mxxx-series | Fuji Electric | Industrial drives, BESS PCS | 3–20 kW per module |
| Custom SiC | Wolfspeed, ROHM, onsemi | Premium PCS, high-frequency power conversion | 5–30 kW per module |
| Custom OEM footprints | RFQ-specific | Custom inverter / drive programmes | Per RFQ |
Section 2 of 3
How does AS/NZS 4777.2 affect cold plate design?
AS/NZS 4777.2:2020 (Grid connection of energy systems via inverters — Inverter requirements) governs grid-connected inverters in Australia. For grid-forming BESS sites — 74% of AU's BESS pipeline per AEMO Q1 2026 — the PCS / inverter cooling requirement scales with inverter power rating. ToneCooling cold plates are design-aware to AS/NZS 4777.2: thermal envelope aligns with IGBT/SiC junction temperature limits, and cold plate documentation supports the licensed AU electrical installer's compliance review.
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Junction temperature
Tj ≤ 125 °C IGBT, ≤ 150 °C SiC. Cold plate thermal envelope sized to maintain margin under worst-case AU summer ambient (50 °C outdoor PCS enclosure).
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Documentation handoff
Cold plate documentation supports AS/NZS 4777.2 installer compliance review. Carlton VIC team coordinates handoff.
Section 3 of 3
What joining process suits power electronics cold plates?
For copper power electronics cold plates, vacuum brazing or TLP diffusion bonding (premium thermal cycling). For aluminium plates serving inverter / PCS applications, friction stir welding (FSW) is the dominant process — same family as Tier-1 automotive traction drive cold plates. Helium leak ≤ 1×10⁻⁹ mbar·L/s, ultrasonic C-scan 100% inspection, AS/NZS 60068-2-14 thermal cycling validation.
| Process | Material | Typical application | Thermal cycling reliability |
|---|---|---|---|
| TLP diffusion bonding | Copper C1100 | Premium IGBT / SiC, high-cycling traction drive | 99% yield, 0.85 bond strength |
| Vacuum brazing | Copper C1100 | Standard IGBT / SiC modules, static PCS | 90% yield, 0.75 bond strength |
| Friction stir welding (FSW) | Aluminium 6061 / 6063 | Inverter / PCS, traction drive (Tier-1 auto) | Robotic FSW, automotive-grade |
| Skive-and-bond fin | Copper / aluminium | Cost-optimised low-power IGBT modules | Volume-scalable |
FAQ
What IGBT/SiC module footprints are supported?
Standard footprints from Infineon (EconoDUAL/PrimePACK/EasyPACK), Semikron (SEMITRANS/SEMiX), Mitsubishi (CM-series), Fuji (M-series), plus custom SiC (Wolfspeed/ROHM/onsemi) and custom OEM footprints. 3–25 kW per module envelope. Tj ≤ 125 °C IGBT / ≤ 150 °C SiC.
How does AS/NZS 4777.2 affect cold plate design?
AS/NZS 4777.2:2020 governs grid-connected inverters in AU. ToneCooling cold plates are design-aware: thermal envelope aligns with IGBT/SiC junction temperature limits; documentation supports the licensed AU electrical installer's compliance review.
What joining process suits power electronics cold plates?
Copper: vacuum brazing or TLP diffusion bonding (premium thermal cycling). Aluminium: friction stir welding (FSW), Tier-1 automotive grade. All validated to helium leak ≤ 1×10⁻⁹ mbar·L/s, 100% ultrasonic C-scan, AS/NZS 60068-2-14 thermal cycling.
Continue Exploring
Related ToneCooling Australia pages
PRODUCT
Custom Cold Plate Manufacturing
OEM-custom programmes for grid-forming inverter and traction drive cold plates.
View product → RESOURCEAS/NZS Standards Reference
24+ standards mapped — AS/NZS 4777.2 PCS / inverter context for grid-forming BESS.
View reference → CAPABILITYValidation & Qualification
Helium leak ≤ 1×10−&sup9; mbar·L/s, ultrasonic C-scan, AS/NZS 60068-2-14 thermal cycling.
View capability → CAPABILITYAS/NZS Compliance Support
AS/NZS 4777.2 design-aware documentation for grid-connected inverter programmes.
View capability →Send your power electronics cold plate brief
Module footprint, Tj envelope, target ΔP, AS/NZS 4777.2 context, programme volume — Carlton-coordinated 24-hour response with technical review by Huizhou.
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