Updated 28 April 2026Global site →

Solutions Hub · 5 Solution Areas

Liquid Cooling Solutions for Australian Industry

ToneCooling Australia organises its work around 5 solution areas relevant to Australian engineering: AI server liquid cooling, data centre liquid cooling, BESS energy storage, power electronics cooling, and industrial cold plates. Each area has distinct thermal physics, regulatory framing, and integration constraints — landing on the right solution page lets your engineering and procurement team have the right design conversation in one click. Cold plates are designed, engineered & manufactured at our IATF 16949-aligned partner facility in Huizhou, with AS/NZS compliance support from Carlton VIC.

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Solution areas
5
AI · Data Centre · BESS · Power · Industrial
AI rack density
80–120 kW
per rack · direct-to-chip
AS/NZS scope
5139 · 4777 · 60068
design-aware compliance
Carlton response
24 h
AEST/AEDT business hours

Liquid cooling solutions for Australian engineering teams — direct-to-chip cold plate kits aligned to the NVIDIA GB200 NVL72 platform, the Open Compute Project DC-MHS specification, and the ASHRAE TC 9.9 Datacom guideline. AS/NZS scope per Standards Australia.

Process & standards glossary (AU engineering reader): TLP = Transient Liquid Phase diffusion bonding · FSW = Friction Stir Welding · CAB = Controlled Atmosphere Brazing · PPAP = Production Part Approval Process · IATF 16949:2016 (international automotive QMS) · ISO 9001:2015 (quality management) · AS/NZS 60068-2-14IEC 60068-2-14:2009 (thermal cycling endurance) · IEC 62619:2017 (industrial battery safety) · AS/NZS 5139:2019 (BESS installation) · AS/NZS 4777.2:2020 (grid-connected inverter).
Page reviewed by ToneCooling Australia Customer Engineering Support Team · Carlton, VIC · Last reviewed: 28 April 2026 · About the team →
5 solution areas — primary AI server / data centre + secondary BESS / power electronics / industrial. Each maps to a specific Australian customer segment with documented thermal envelope, regulatory framing, and lead-time profile.
GB200 Bianca module cold plate
PRIMARY · Phase 1

AI Server Liquid Cooling

Direct-to-chip cold plate kits for NVIDIA GB200, GB300, H200, AMD EPYC SP5, Intel Birch Stream — five AI server platforms most deployed in AU sovereign cloud, Pawsey/NCI HPC, and edge AI.

2,700 W per Bianca · 18.5–35 kPa ΔP · as agreed at quotation prototype Explore solution
Data centre rack-level CDU integration
PRIMARY · Phase 1

Data Centre Liquid Cooling

Cold plate kits for AU colocation, sovereign cloud, and HPC refresh deployments. CDU-vendor compatible — Vertiv, CoolIT, Stulz, Motivair. Rack power density 80–120 kW+ supported.

ASHRAE W32/W40 aligned · 80–120 kW rack · ChAFTA Cert. Explore solution
TC-1P104S BESS cold plate
SECONDARY · AU Industry

BESS Energy Storage

Liquid cooling cold plates for Australian grid-scale battery energy storage. TC-1P104S real test data: 4 Pa air-tightness leak, 21.2 kPa ΔP, 6.2 °C cell-top ΔT. PFAS-free SGS-certified, AS/NZS 5139 design-aware.

AEMO ISP / CIS aligned · 6.2 °C ΔT · 4 Pa leak (vs 30 Pa) Explore solution
IGBT / SiC module cold plate
SECONDARY · AU Industry

Power Electronics Cooling

IGBT and SiC module cold plates for grid-forming inverters, traction drives, and PCS power electronics. AS/NZS 4777.2 PCS context-aware. Supports Infineon, Semikron, Mitsubishi, Fuji module footprints.

3–25 kW per module · Tj ≤ 125–150 °C · FSW joining Explore solution
Industrial laser / medical imaging cold plate
LONG-TAIL · AU Industry

Industrial Cold Plates

Custom cold plates for fibre and CO₂ laser sources, medical imaging gradient coils, factory automation drives, semiconductor process tools, and welding equipment.

0.3 mm channel · ΔT ≤ 0.5 °C surface · Low-MOQ Explore solution

How does each solution area's thermal envelope compare?

SolutionHeat source / cell loadCold plate ΔP envelopeJoining processPrototype lead time
AI Server700–2,700 W per die18.5–35 kPaTLP / vacuum brazeAgreed at quotation
Data Centre80–120 kW per rack25–45 kPa rack-levelTLP / vacuum brazeAgreed at quotation
BESS15 W per cell × 10415–25 kPaCAB stamped-brazedAgreed at quotation
Power Electronics3–25 kW per module10–20 kPaFSW / CABAgreed at quotation
Industrial100 W–10 kW (varies)5–25 kPa (varies)Per-applicationAgreed at quotation

Australian liquid cooling solutions FAQ

Which Australian industries does ToneCooling Australia serve?

5 solution areas: AI server liquid cooling (NVIDIA GB200/GB300/H200, AMD SP5, Intel Birch Stream), data centre liquid cooling (sovereign cloud, Pawsey/NCI HPC, colocation), BESS (TC-1P104S reference, AEMO ISP-aligned), power electronics (IGBT, SiC, grid-forming PCS), industrial (laser, medical imaging, robotics, semiconductor).

What primary platforms are supported across solutions?

AI server: NVIDIA GB200/GB300/H200, AMD EPYC SP5, Intel Birch Stream. BESS: TC-1P104S. Power electronics: IGBT/SiC modules from Infineon, Semikron, Mitsubishi, Fuji. Industrial: IPG/Coherent/Trumpf laser, Siemens/GE/Philips medical imaging, ABB/Festo/FANUC automation.

How does BESS cooling differ from AI server cooling?

AI server: high-heat-flux per area (700–2,700 W concentrated on small die), narrow ΔT, tight CDU pressure, copper micro-channel topology. BESS: low flux distributed across many cells (15 W × 104), broader ΔT, looser pressure, stamped-brazed aluminium plates. Both validate to helium leak ≤ 1×10⁻⁹ mbar·L/s.

What custom programmes are accepted?

Custom programmes accepted across all 5 solution areas. Low-MOQ, as agreed at quotation (AI server) or as agreed at quotation (BESS / power electronics / industrial) lead time. PPAP Levels 1–5 supported. Cold plate design and engineering at Huizhou; AS/NZS compliance support from Carlton VIC.

Which liquid cooling solution fits your Australian programme?

Click into a solution page, or send your RFQ now and the Carlton VIC team will route to the correct Huizhou engineering team.

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